The logic flow chart of the dispensing mechanism is shown in Figure 6-11. The two cooperate to form the glue dispensing system of the die bonder. The dispensing organization is responsible for dispensing, and the dispensing platform is responsible for moving the glue cup. In view of the complexity of die-bonding motion control and the limited space of this article, this article only describes the design of the dispensing mechanism and dispensing platform. Design examples of dispensing mechanism and platform movement Carry on the logical object division to the die-bonding machine movement system,ġ. The die-bonding motion system includes 2 groups of dual-axis planar moving array mechanism platforms for dispensing positioning, 1 group of die-bonding dual-axis planar moving array mechanism platforms, and 1 group of dual-axis position moving mechanism platforms for searching and dynamically calculating the target position of the die And so on, these 4 groups of platforms constitute the most difficult part of the logic of the die bonding system. Each small segment of logic is part of the movement of the whole machine, which is equivalent to taking some sections of the whole machine's logic to make a single action according to the mechanism. In addition, the manual adjustment machine is composed of the dispensing head 1, the dispensing head 2, the crystal absorption, the crystal bonding, the feeding and the discharging many small pieces of logic, a total of 63, the operation page of the manual adjustment is shown in Figure 8. The composition of the motion control system of the die bonder It is set to control the placement accuracy of a single wafer to facilitate the operation of the test machine, and the automatic operation is a fully automatic die bonding without human operation. The manual adjustment is designed to facilitate the debugging personnel to repair the equipment, the joystick operation is to make the movement of the crystal frame more convenient, and the system reset is the output point of the entire equipment and the motor and other actuators return to the original point and safe position, and move in a single step. The composition of the movement logic system is shown in Figure 7.
The movement of the entire equipment consists of manual adjustment, joystick operation, system reset, single-step movement and automatic operation.
In the motion control part of the solid crystal system example in this article, the drive hardware includes 8 stepper motors, 12 servo motors and 4 linear motors, the output actuator has 24 points, and the input detection sensor has 18 points. Please contact the Wire bonder equipment manufacturer directly for more information.1. Wire Bonders manual and semi-automatic ball conder and wedge bonder for open cavity QFN packages, Semiconductor and MEMS.
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